Packaging of an Amplifier Module for Sub-THz Wireless Transmission Based on Photonics

Year

2023

Author

Sooyeon Kim

Co-author

Chan-Gyu Choi, Sang-Rok Moon, Minkyu Sung, Eon-sang Kim, Ho-Jin Song, Hyunhak Jeong, Seung Hwan Kim, Seung-Hyun Cho

Journal

Journal of Electromagnetic Engineering & Science

Status

Accepted